Module packaging – which statement about a DIMM (dual inline memory module) is accurate regarding its connector contacts and data path?

Introduction / Context:
Memory modules evolved from SIMMs (single inline memory modules) to DIMMs (dual inline memory modules) to support wider data buses and higher bandwidth. Knowing the physical and electrical differences helps in correctly identifying modules and motherboard compatibility.

Given Data / Assumptions:

• SIMMs historically had 30 or 72 contacts with mirrored signals on each side.
• DIMMs provide distinct contacts on the two sides of the edge connector.
• Wider data paths reduce the number of modules needed for a given bus width.

Concept / Approach:
A DIMM has separate electrical contacts on both faces of the connector (hence “dual inline”), allowing more pins and therefore wider data and control interfaces (for example, 168-pin SDR, 184-pin DDR, 240-pin DDR2/DDR3, 288-pin DDR4/DDR5). SIMMs have contacts that are the same electrical node on both sides (“single inline”), offering fewer unique signals. Therefore, the accurate statement is that DIMMs have contacts on both sides enabling larger data paths.

Step-by-Step Solution:

Verification / Alternative check:
Motherboard memory slot specifications list pin counts corresponding to DIMM generations, confirming dual-sided distinct contacts and wider interfaces.

Why Other Options Are Wrong:
30/72-pin packages belong to SIMMs; DIMMs do not have pins only on one side; capacity comparisons depend on generation, not SIMM vs DIMM; keying notches differ across generations and are not shared with SIMMs.

Common Pitfalls:
Assuming “pins on both sides” means mirrored signals; in DIMMs, they are distinct contacts, which is the key difference from SIMMs.

Final Answer:
has contact pins on both sides of the module for larger data paths