Question 1

Environmental dependence: Do logic delay times and current/voltage characteristics remain constant regardless of temperature, supply variation, and load (for families such as TTL)?

Accepted Answer

Introduction / Context: Real digital devices exhibit parameter drift with environment and operating conditions. Designers must use worst-case values for reliable timing and noise margins. This question evaluates whether delay, thresholds, and IO currents are invariant. Given Data / Assumptions: TTL-family logic at nominal 5 V. Operating temperature spanning commercial or industrial ranges. Load capacitance and fan-out may vary. Concept / Approach: Propagation delay and VOH/VOL are functions of transistor behavior, which changes with temperature and supply voltage. Input/output currents also vary. Therefore, datasheets provide min/typ/max specs and test conditions; robust design uses guard bands and static timing analysis with worst-case corners. Step-by-Step Solution: Identify key parameters: tpHL, tpLH, VOH/VOL, IOH/IOL, VIH/VIL.Consult datasheet tables showing temperature and VCC dependencies.Design using worst-case (max delay, min VOH, max VOL) for guaranteed margins. Verification / Alternative check: Compare measurements at 0 °C vs 70 °C: propagation delay and VOH/VOL shift measurably; simulation corners (slow-slow, fast-fast) capture this spread. Why Other Options Are Wrong: “Constant over all environments” ignores semiconductor physics. “Only with heat sink” misses voltage and process/temperature effects. “Only Schottky TTL/ECL” still shows variation; no family is perfectly constant. Common Pitfalls: Designing to typical numbers; forgetting derating at low VCC; ignoring capacitive loading that affects edge rates. Final Answer: Invalid — timing and IO values vary with conditions; always use datasheet ranges.

Question 2

NMOS logic capability: Do NMOS logic families implement arbitrary logic networks (since NAND is a universal gate), using MOSFETs to realize the full range of logic functions?

Accepted Answer

Introduction / Context: Before CMOS dominated, NMOS logic was widely used in microprocessors and standard logic. Theoretically, certain gates are universal, meaning any Boolean function can be constructed from them. This question checks recognition that NMOS can realize complete logic via MOSFET networks. Given Data / Assumptions: NMOS uses n-channel MOSFET pull-down networks with resistive or active pull-ups. NAND and NOR are universal gates in Boolean algebra. Practical considerations (power and noise) are separate from functional completeness. Concept / Approach: Universality: any Boolean function can be built from NAND alone or NOR alone. NMOS technology can implement NAND/NOR using series/parallel nMOS networks and a pull-up device. Therefore, NMOS can realize arbitrary logic despite different performance characteristics versus CMOS. Step-by-Step Solution: Express the target logic as a network of NAND or NOR gates.Map each gate to an NMOS pull-down network (series = AND, parallel = OR) plus a pull-up.Verify that cascade of inverters and NAND/NOR realizes the Boolean function. Verification / Alternative check: Historic NMOS CPUs (e.g., early microprocessors) demonstrate complex logic realized entirely in NMOS, confirming functional completeness. Why Other Options Are Wrong: “Only inverters and NOR” understates capability; NAND/NOR/inverters suffice for completeness. “Only CMOS can realize complete logic” is false in Boolean terms. “Requires bipolar devices” confuses device physics with logic algebra. Common Pitfalls: Equating functional completeness with optimal power efficiency; NMOS has static power draw with resistive pull-ups, which is why CMOS replaced it for mainstream logic. Final Answer: Valid — NMOS can implement arbitrary logic because NAND/NOR are universal.

Question 3

TTL output asymmetry: Is the HIGH-level source current capability of TTL typically smaller than the LOW-level sink current (i.e., TTL sinks more than it sources)?

Accepted Answer

Introduction / Context: TTL outputs are asymmetric. Designers exploit this when selecting pull-ups, driving LEDs, or budgeting fan-out. Knowing which state offers stronger drive prevents logic-level violations and slow edges. Given Data / Assumptions: Standard 74xx/74LS TTL family behavior. Typical IOH is small in magnitude; IOL is significantly larger. 5 V nominal supply. Concept / Approach: In TTL, the output transistor network sinks current efficiently at a logical LOW and sources less at a logical HIGH. Datasheets often show IOL in the range of 8–16 mA (or higher for drivers), while IOH is around -0.4 mA. This asymmetry shapes interface design. Step-by-Step Solution: Check datasheet: note IOH (source when HIGH) is small in magnitude.Note IOL (sink when LOW) is much larger.Conclude that TTL is better at sinking loads; prefer active-low driving for LEDs or similar loads. Verification / Alternative check: Practical lab tests show LEDs glow brighter with active-low connection through TTL because sinking current is stronger and VOH degrades with heavy sourcing. Why Other Options Are Wrong: “Sources more than sinks” contradicts specifications. “Only for open-collector” is incorrect; asymmetry also exists in totem-pole outputs. “Always equal” is not true for TTL families. Common Pitfalls: Overloading a TTL output at HIGH, causing VOH to sag and violating VIH of the next stage. Final Answer: Correct — TTL typically sinks more current than it can source.

Question 4

Integrated-injection logic (I²L): Does I²L offer high device density and simpler fabrication compared to TTL, enabling very compact digital circuits?

Accepted Answer

Introduction / Context: Integrated-injection logic (I²L), also called merged-transistor logic, was designed for very high packing density with low power, competing historically with TTL and ECL in certain applications. This question checks recognition of I²L’s density and process simplicity advantages. Given Data / Assumptions: I²L uses bipolar transistors with current injection for logic operation. Low supply voltage and low power consumption. Goal: maximize density and simplify fabrication steps. Concept / Approach: By merging devices and using lateral pnp injectors feeding multiple npn transistors, I²L attains high logic density with fewer processing steps than TTL (which needs multiple diffusions and complex structures). Although slower than the fastest TTL/ECL, I²L’s benefits are area and power. Step-by-Step Solution: Identify I²L device structure: injector supplies base current to multiple npn devices.Note minimal device count per gate and small device geometries.Compare to TTL’s multi-emitter input transistor and totem-pole output requiring more complex fabrication. Verification / Alternative check: Historic literature and textbooks highlight I²L’s extremely high gate density and simple process, particularly in early low-power VLSI contexts. Why Other Options Are Wrong: “Larger and more complex” contradicts the design goal of I²L. “Analog-only” mischaracterizes a digital logic family. “Requires >10 V” is incorrect; I²L uses low supply voltages. Common Pitfalls: Assuming density always correlates with speed; I²L trades off speed for density and simplicity. Final Answer: Valid — I²L offers high density with simple fabrication compared to TTL.

Question 5

Tri-state outputs: Can a three-state TTL output present three distinct states on its pin — logic LOW, logic HIGH, or a high-impedance (floating) state?

Accepted Answer

Introduction / Context: Tri-state (three-state) outputs are essential for shared buses. By adding an enable control, the output driver can disconnect from the line, allowing multiple devices to share the same signal path without contention. Given Data / Assumptions: TTL or CMOS devices with OE (output enable) pins. Bus-oriented systems where multiple devices must take turns driving a line. High-impedance state presents effectively no drive. Concept / Approach: With OE asserted, the output driver actively drives LOW or HIGH. With OE deasserted, both pull-up and pull-down devices are turned off, leaving the pin in a high-impedance state. External pull-ups/downs or bus keepers may define the idle level. Step-by-Step Solution: Enable output: device drives LOW or HIGH per logic.Disable output: output stage disconnects, presenting high-Z.Use bus arbitration to ensure only one driver is enabled at a time. Verification / Alternative check: Datasheets specify three-state characteristics, including IOZ (leakage currents) and enable/disable timing parameters. Why Other Options Are Wrong: “Only LOW/HIGH” ignores the high-Z mode. “Requires >6 V” is not part of three-state operation. “Only with open-collector” confuses passive pull-ups with active three-state drivers; they are different concepts. Common Pitfalls: Forgetting to include pull resistors or bus keepers; enabling two drivers simultaneously causing bus contention and potential damage. Final Answer: Yes — three-state outputs provide LOW, HIGH, or high-impedance.

Question 6

TTL 7400 NAND gate output when HIGH: What is the proper name for the output current capability in the HIGH state for a single 7400 output pin?

Accepted Answer

Introduction / Context: Logic datasheets specify separate output-current capabilities for LOW and HIGH states. Correct terminology matters when reading and applying VOH/VOL and fan-out specifications for TTL and CMOS outputs. Given Data / Assumptions: Device: 7400-series TTL NAND gate. State of interest: output logic HIGH. Industry-standard notation: IOH for HIGH-state output current, IOL for LOW-state output current. Concept / Approach: When a TTL output is HIGH, any external load connected to the pin draws current from the output to ground; the gate is “sourcing” current. The maximum guaranteed current in that state is specified as IOH (often a small magnitude compared with IOL). Conversely, in the LOW state the output “sinks” current, specified as IOL. Step-by-Step Solution: Identify state: output HIGH.Define direction: current leaves the output into the load — sourcing.Use correct symbol: IOH denotes HIGH-state output current capability. Verification / Alternative check: Datasheets list IOH and IOL separately (e.g., IOH ≈ -0.4 mA, IOL ≈ 16 mA for LS-TTL), confirming the naming convention and asymmetry. Why Other Options Are Wrong: “Sink current” applies to the LOW state. “source current” alone is descriptive but omits the standard symbol; “IOH” alone omits the verbal description. The most complete, unambiguous phrasing is “source current or IOH.” Common Pitfalls: Confusing sourcing with sinking directions; misreading the sign convention for IOH (often negative to indicate current leaving the device). Final Answer: source current or IOH.

Question 7

Large-scale integration (LSI) classification in digital ICs  In integrated-circuit technology, “large-scale integration (LSI)” refers to chips that contain a mid-to-high count of interconnected devices but are below very large-scale integration (VLS…

Accepted Answer

Introduction / Context: Digital integrated circuits are historically classified by the number of active devices (gates/transistors) fabricated on a single chip. These categories—SSI, MSI, LSI, and VLSI—help engineers discuss complexity, density, and typical application domains. The question asks specifically for the component-count range that is generally associated with large-scale integration (LSI). Given Data / Assumptions: We use classic textbook-era ranges, acknowledging that modern chips often exceed VLSI by orders of magnitude. “Components” refers to devices/gates on the IC, not passive external parts. Goal: select the best-matching range among the provided options. Concept / Approach: Traditional benchmarks place SSI (small-scale integration) at roughly 1–10 gates, MSI (medium-scale) at about 10–100 or up to a few hundred, LSI (large-scale) from the low thousands up to the tens of thousands, and VLSI beyond that (hundreds of thousands to millions and more). While exact boundaries vary across sources, LSI is typically quoted as the “thousands to tens of thousands” region. Step-by-Step Solution: Identify typical LSI region: thousands to tens of thousands of devices.Compare with choices: 1,500–15,000 aligns closely with that conventional bracket.Check alternatives: 180–1,000 is too small (MSI). 180–1,500 straddles MSI/low LSI but is mostly below LSI. 15,000–150,000 extends well into VLSI territory for classic definitions.Hence, 1,500–15,000 is the best fit for LSI. Verification / Alternative check: Older digital logic texts frequently chart examples: MSI (counters, multiplexers), LSI (simple microcontrollers, larger memory arrays of the era), and VLSI (microprocessors, large memories). The thousands-to-tens-of-thousands rule-of-thumb matches the selected range. Why Other Options Are Wrong: 15,000–150,000: largely VLSI by traditional standards.180–1,000: this lies in MSI territory.180–1,500: still dominated by MSI; only its top end brushes low LSI. Common Pitfalls: Forgetting that modern densities dwarf historical categories; however, the question explicitly targets conventional definitions used in foundational courses. Final Answer: 1,500, 15,000

Question 8

Open-collector TTL/CMOS output requirement  To obtain a valid logic HIGH or LOW from an open-collector gate, what external element must be connected between +VCC and the collector terminal?

Accepted Answer

Introduction / Context: Open-collector (TTL) and open-drain (CMOS) outputs are widely used for wired-OR connections, level interfacing, and bused signals. Unlike totem-pole outputs, an open-collector stage cannot drive a logic HIGH by itself; it only sinks current when asserted LOW. Understanding the needed external component is essential for correct operation. Given Data / Assumptions: An open-collector output contains an internal transistor whose collector node is brought to the pin. When the transistor is ON, it pulls the output LOW by sinking current. When OFF, the node is otherwise floating unless externally biased. Concept / Approach: To create valid logic levels, a passive element must pull the output node HIGH when the internal transistor is OFF. The standard solution is a pull-up resistor connected from +VCC to the collector. The resistor supplies a small current to raise the node to HIGH, while still allowing the internal transistor to sink the node LOW when it turns ON. Step-by-Step Solution: Recognize output stage: open collector = only sinking capability.Determine needed HIGH: require a path to +VCC through a resistor so the node charges HIGH when the transistor is OFF.Select proper value: choose a pull-up value that balances rise time (lower R speeds edges) with current limit (higher R reduces current when LOW).Result: a stable, defined logic HIGH or LOW is achieved. Verification / Alternative check: Datasheets for open-collector devices specify VOL at certain sink currents given a pull-up resistor; app notes show wired-OR by tying multiple open collectors to one pull-up. Why Other Options Are Wrong: Pull-down resistor: would force LOW or undefined HIGHs; not suitable.Diode / Buffer: neither alone creates the required default HIGH level; a buffer would still need a defined input bias. Common Pitfalls: Choosing too small a resistor (excessive current and power) or too large (slow rise time, susceptibility to noise). Final Answer: pull-up resistor

Question 9

Practical use of a Schmitt trigger (hysteresis comparator)  Select a typical, real-world application where a Schmitt trigger is commonly employed in digital or mixed-signal systems.

Accepted Answer

Introduction / Context: A Schmitt trigger is a comparator with hysteresis: it uses two distinct threshold voltages to switch its output, providing noise immunity and clean transitions. It is a staple building block at the interface of analog and digital domains, often included at inputs that receive slowly varying or noisy signals. Given Data / Assumptions: Schmitt triggers have separate V_T+ (rising) and V_T− (falling) thresholds. They square up sluggish waveforms and reject small, fast disturbances. We are to choose a representative, mainstream use case. Concept / Approach: Because of hysteresis, the output changes state only after the input crosses a higher threshold on the way up and a lower threshold on the way down. This behavior removes chatter near a single threshold and is ideal for conditioning noisy or slow signals into crisp logic pulses—i.e., pulse shaping. Step-by-Step Solution: Identify need: a bouncy, noisy, or slow-ramping signal (e.g., sensor, RC network, mechanical switch).Apply Schmitt trigger: use hysteresis to produce clean digital transitions.Resulting function: waveform “squaring” and timing cleanup → a pulse shaper.Additional uses: debouncing, waveform conditioning before digital counters/timers. Verification / Alternative check: Datasheets for logic families (e.g., 74HC14) advertise Schmitt-trigger inputs specifically for shaping and noise rejection on slow edges. Why Other Options Are Wrong: Astable oscillator: while Schmitt gates can participate in oscillators, the canonical distinct role is input conditioning; “pulse shaper” best captures the generalized use.Transition pulse generator: more specialized; not the broad, standard description.Buffer: generic term lacking the key hysteresis function. Common Pitfalls: Assuming any inverter can clean a waveform; without hysteresis, small noise around the threshold causes chatter. Final Answer: pulse shaper

Question 10

Undefined logic condition terminology  An input or node that is neither driven to a valid logic HIGH nor to a valid logic LOW is best described as which state?

Accepted Answer

Introduction / Context: Digital circuits rely on clearly defined voltage levels to represent logic 0 and logic 1. When a node is not actively driven or properly biased, its voltage can wander, pick up interference, or sit at an indeterminate level. Recognizing and naming this condition is crucial to robust design and debugging. Given Data / Assumptions: A logic input is left unconnected (no pull-up/pull-down) or an output stage is high-impedance without external bias. Standard logic families expect finite source/sink paths to set valid thresholds. Terminology should reflect the electrical condition, not a design-time notation. Concept / Approach: When a digital node is undriven, it is “floating.” A floating input can drift due to leakage and capacitive coupling, leading to unpredictable switching and power consumption. Designers prevent floating states with bias networks (pull-ups/pull-downs), keeper circuits, or by ensuring every input is tied to a defined level. Step-by-Step Solution: Identify the scenario: input left unconnected or output tri-stated without bias.Recognize the behavior: voltage indeterminate, susceptible to noise and EMI.Name the state: this is a floating condition.Mitigate: add pull-up/pull-down or use bus keepers/termination to set a default level. Verification / Alternative check: Oscilloscope traces of floating nodes show random or slow drift; data sheets warn against leaving CMOS inputs floating due to shoot-through current and oscillation. Why Other Options Are Wrong: Don't care: a logic minimization term indicating either 0 or 1 is acceptable in design—not an electrical node condition.Minimum state: not a standard term for this context.Noise: a phenomenon, not a state; noise may affect a floating node but is not the state itself. Common Pitfalls: Assuming “high impedance” equals “safe.” High-Z outputs still need external biasing on shared lines to avoid floating receivers. Final Answer: floating

Question 11

What do PMOS and NMOS denote in logic families?  Choose the statement that correctly characterizes PMOS and NMOS technologies within digital gates.

Accepted Answer

Introduction / Context: Digital IC technologies can be categorized by the transistor types used in their logic gates. PMOS and NMOS refer to families that build gates primarily with one channel type, while CMOS uses complementary pairs of both P-channel and N-channel MOSFETs. Understanding the distinction clarifies performance, power, and interfacing behaviors. Given Data / Assumptions: PMOS logic: uses P-channel MOSFETs predominately in the pull-down/pull-up networks depending on topology. NMOS logic: uses N-channel MOSFETs as the primary active devices, often with resistive or depletion pull-ups. CMOS: complementary use of both types within each gate for low static power. Concept / Approach: PMOS and NMOS are historical and educationally important. NMOS provided speed advantages over PMOS; CMOS later displaced both for most logic due to drastically lower static power and better noise margins. Terminology matters: PMOS/NMOS do not denote “74HC,” which is a CMOS family, and do not refer to “positive/negative” supply concepts. Step-by-Step Solution: Define PMOS: logic built with P-channel MOSFETs predominantly.Define NMOS: logic built with N-channel MOSFETs predominantly.Compare to CMOS: complementary P and N devices within the same gate (e.g., 74HC series).Select the option that reflects exclusive channel use within a given gate. Verification / Alternative check: Textbook logic family charts list PMOS, NMOS, and CMOS separately; 74HC is explicitly CMOS with complementary devices. Why Other Options Are Wrong: Enhancement type CMOS / 74HC: that describes CMOS, not PMOS/NMOS families.“Positive and negative MOS” with op-amp compatibility: not a standard description and mixes unrelated concepts.None of the above: incorrect because option A is accurate. Common Pitfalls: Assuming PMOS/NMOS are just subsets of CMOS or confusing family names (TTL, HC, HCT, AC, etc.). Final Answer: represent MOSFET devices utilizing either P-channel or N-channel devices exclusively within a given gate

Question 12

Definition of fanout in digital logic families  What do we call the maximum number of standard logic inputs that a single gate output can reliably drive without causing logic-level errors?

Accepted Answer

Introduction / Context: When interconnecting digital devices, a single output often drives multiple inputs. Each input draws some current (or presents capacitance), and the driving gate has limited sourcing/sinking capability. The term that quantifies “how many loads” can be connected is fundamental to reliable system design. Given Data / Assumptions: A logic family specifies I_OH/I_OL (output current limits) and I_IH/I_IL (input current requirements). Fanout is computed separately for HIGH and LOW states in many families. Voltages must remain within VIH/VIL thresholds under load to avoid errors. Concept / Approach: Fanout is defined as the number of identical inputs that a single output can drive while guaranteeing valid logic levels. Engineers compare the driver’s guaranteed output current to the sum of the receivers’ required input currents to determine maximum loading for both logic states. Step-by-Step Solution: Check datasheet: obtain I_OH and I_OL for the driver, I_IH and I_IL for the receivers.Compute HIGH-state fanout: Fanout_H ≈ |I_OH| / |I_IH|.Compute LOW-state fanout: Fanout_L ≈ |I_OL| / |I_IL|.Choose the minimum of the two as the allowable fanout to ensure both states meet specs. Verification / Alternative check: Classic TTL example: I_OH ≈ −0.4 mA and I_IH ≈ 40 µA → ≈10 loads; I_OL ≈ 16 mA and I_IL ≈ 1.6 mA → ≈10 loads, yielding a fanout of 10. Why Other Options Are Wrong: Propagation delay: time for a signal to traverse a gate; unrelated to count of loads.Noise margin: allowable noise amplitude before errors, not a load-count metric.Speed-power product: a figure of merit balancing delay and power, not loading capacity. Common Pitfalls: Ignoring capacitive loading and rise/fall-time degradation—fanout is a DC specification; dynamic performance may limit practical loading further. Final Answer: fanout

Question 13

Standard TTL output behavior at logic HIGH  For a standard TTL gate whose output is in the HIGH state, what is its guaranteed output-current capability and typical loading limit in terms of attached inputs?

Accepted Answer

Introduction / Context: TTL (Transistor-Transistor Logic) families specify distinct source/sink capabilities depending on whether an output is HIGH or LOW. Designers must respect these limits to maintain valid logic levels and avoid overloading. The question focuses on the HIGH-state capability and the conventional fanout interpretation. Given Data / Assumptions: Standard TTL input requirements: I_IH ≈ 40 µA (max), I_IL ≈ 1.6 mA (max). Standard TTL output capability: I_OH ≈ −0.4 mA (i.e., can source about 400 µA when HIGH), I_OL ≈ 16 mA (can sink when LOW). Fanout traditionally about 10 in both states for classic 74xx TTL. Concept / Approach: At logic HIGH, the TTL output can source only a small current (hundreds of microamps). Dividing the available source current by the required HIGH input current per load gives a loading limit of roughly 10 standard TTL inputs. Step-by-Step Solution: Identify HIGH-state drive: I_OH ≈ −0.4 mA (sources current).Identify receiver requirement: I_IH ≈ 40 µA per input.Compute fanout: 0.4 mA / 40 µA ≈ 10 inputs.State the capability: sources about 400 µA total to no more than ~10 standard loads. Verification / Alternative check: Datasheets for 74xx TTL list these limits explicitly; TTL gates are stronger at sinking current in LOW state (16 mA) than sourcing at HIGH. Why Other Options Are Wrong: Sink 16 mA: this is LOW-state behavior, not HIGH-state.Source 16 mA: far exceeds HIGH-state source capability.Sink 400 µA: sign is reversed and not the defining HIGH-state spec. Common Pitfalls: Confusing source vs. sink directions; misapplying LOW-state numbers to the HIGH state; ignoring that different TTL subfamilies (LS, ALS, etc.) tweak values but preserve the general relationships. Final Answer: source 400 µA of current to no more than 10 attached gates

Question 14

Can totem-pole outputs be tied together?  Evaluate the safe interconnection of totem-pole (push–pull) logic outputs and select the best explanation for whether they may be directly paralleled.

Accepted Answer

Introduction / Context: Totem-pole (push–pull) outputs actively drive both HIGH and LOW using complementary transistors. They provide fast edges but are not intended for wired-OR/wired-AND interconnection. Understanding why prevents device damage and bus contention in digital systems. Given Data / Assumptions: Each totem-pole output sources current when HIGH and sinks current when LOW. No inherent isolation exists between tied outputs. Logic states can differ momentarily due to skew or permanently due to differing logic. Concept / Approach: If two totem-pole outputs are directly tied and ever drive opposite states, one device will attempt to source while the other sinks, creating a near-short between supply rails through the output transistors. This can cause excessive current, heating, logic errors, or catastrophic failure. Open-collector/open-drain outputs, by contrast, are designed for wired-OR with a shared pull-up. Step-by-Step Solution: Identify output type: totem-pole actively sources and sinks.Consider contention: opposite logic states create a direct conduction path.Conclude: do not tie totem-pole outputs together; use proper bus transceivers or open-collector/open-drain architecture for wired connections.Alternative: use diodes or resistors only if explicitly allowed by the design and timing constraints. Verification / Alternative check: Family datasheets and application notes forbid paralleling totem-pole outputs. Bus architectures use tri-state (three-state) outputs with arbitration instead. Why Other Options Are Wrong: “Can in parallel/series”: unsafe or irrelevant; series connection does not meaningfully raise logic voltage and compromises signal integrity.“Can together for higher load”: ignores contention risks and absolute maximum ratings. Common Pitfalls: Assuming paralleling works because it does for power supplies; digital outputs are not current-sharing devices and lack ballast for equalization. Final Answer: cannot, together, if the outputs are in opposite states excessively high currents can damage one or both devices

Question 15

What can an open-collector output do?  Choose the statement that correctly describes the current capability and limitation of an open-collector digital output stage.

Accepted Answer

Introduction / Context: Open-collector outputs are ubiquitous for wired-OR logic, level shifting, and driving external loads like LEDs or relays (through appropriate interfaces). Knowing whether they can sink or source current determines how you connect pull-ups and loads. Given Data / Assumptions: An open-collector stage exposes the collector of an NPN transistor (or open-drain of an NMOS) to the pin. When the transistor turns ON, it pulls the node toward ground (sinks current). When OFF, the node is high-impedance and must be pulled up externally to a defined HIGH level. Concept / Approach: Because the internal device only provides a path to ground, it cannot source current up to the node. It can only sink current. A pull-up resistor (or active pull-up) provides the current for the HIGH state; the transistor shunts it to ground for the LOW state. Thus, the correct phrasing is that an open-collector can sink current but cannot source current. Step-by-Step Solution: Turn transistor ON: current flows from VCC through pull-up and load into the collector to ground → sinking action.Turn transistor OFF: node floats and is pulled up by the resistor → output becomes HIGH.No sourcing path from inside the chip to raise the node by itself.Therefore, capability = sink current; limitation = cannot source current. Verification / Alternative check: Datasheets specify I_OL (sink) but not I_OH sourcing in open-collector mode; application circuits always include a pull-up resistor. Why Other Options Are Wrong: Source, sink current: implies internal sourcing path, which does not exist.“Source/sink voltage”: voltage is not “sourced” in this context; current capability is the correct descriptor. Common Pitfalls: Omitting the pull-up resistor and concluding the output is stuck LOW or undefined; forgetting level shifting limits of the pull-up voltage vs. device ratings. Final Answer: sink, source current

Standard Logic Devices (SLD) Questions