Package identification by pin rows An integrated circuit package that has two parallel rows of connection pins is commonly called a:

Introduction / Context:
Recognizing common IC package styles is important for PCB design, footprint selection, and assembly. A very common through-hole style features two parallel rows of pins.

Given Data / Assumptions:

• Through-hole packaging context.
• Two rows of evenly spaced pins.
• Rectangular plastic or ceramic body.

Concept / Approach:
A Dual In-line Package (DIP) has two parallel rows of pins designed for through-hole mounting or sockets. By contrast, a QFP (Quad Flat Package) is surface-mount with pins on four sides. “CMOS” describes a technology, not a package. “Phase splitter” is a circuit function, not a package type.

Step-by-Step Solution:
Identify feature: two in-line pin rows → classic DIP geometry.Exclude alternatives: QFP has four sides of leads; CMOS is not a package; phase splitter is unrelated.Therefore, the described package is a DIP.

Verification / Alternative check:
Common DIPs include 14-pin 74xx logic, 28-pin microcontrollers, and op-amps in 8-pin DIP packages.

Why Other Options Are Wrong:
QFP: four-sided gull-wing leads, SMT only.Phase splitter: circuit role, not packaging.CMOS: fabrication technology (e.g., 74HCxx), not a package.

Common Pitfalls:
Confusing DIP with SIP (single in-line package) which has a single row of pins. Also, SOIC is the SMT counterpart with two rows but surface-mount gull-wing leads.

Final Answer:
a DIP