Question 1

ESD wrist strap safety principle:  An anti-static wrist strap includes a small component so that you do not become the lowest-impedance path to ground. What is that component?

Accepted Answer

Introduction / Context: Electrostatic discharge (ESD) control requires safely equalizing potential between a person and equipment. Wrist straps connect the wearer to ground through a controlled impedance path to bleed charge without creating a shock hazard. Given Data / Assumptions: Standard ESD wrist straps are used with a grounded mat or dedicated ESD ground. We want to avoid a dangerous high-current path while still draining static charges. The strap contains an inline component for current limiting. Concept / Approach: The inline component is a high-value resistor (typically about 1 megaohm). It limits current to safe levels if the wearer touches a live conductor accidentally, while still allowing slow discharge of static electricity to prevent sudden ESD events. Capacitors or diodes are not used for this primary safety function in straps; the resistor provides both protection and controlled bleed. Step-by-Step Solution: Identify the purpose: bleed static charge safely.Select the component that limits current while allowing DC discharge: a high-value resistor.Recall common value: about 1 MΩ inline with the cord to ground.Confirm usage: connect strap to ESD ground, not to building neutral or random metal. Verification / Alternative check: Many straps have a visible barrel with the resistor; continuity testers for ESD kits verify the resistor value. ESD standards recommend such current-limiting elements to meet safety practices. Why Other Options Are Wrong: Capacitor: would pass AC transients and is unsuitable as a sole safety element. Diode/transistor: active or directional components are unnecessary and do not provide the required current limiting in both directions. None of the above: incorrect because a resistor is standard. Common Pitfalls: Clipping the strap to painted or insulated surfaces; bypassing the resistor by DIY cords; failing to test the strap periodically. Always connect to a verified ESD ground point. Final Answer: resistor

Question 2

Disk fragmentation concept:  Which description correctly explains what a “fragmented” hard drive is in terms of file layout and cluster usage?

Accepted Answer

Introduction / Context: On spinning hard disks, file systems allocate clusters to store file data. Over time, as files are created, deleted, and grown, free space becomes scattered, and files can be split across many non-contiguous fragments, increasing seek overhead and slowing access. Given Data / Assumptions: Conventional HDD with FAT/NTFS-like cluster management. No assumption of physical defects; concern is logical allocation. Performance symptoms include long load times and slow sequential reads. Concept / Approach: Fragmentation is a logical placement issue: the bytes of a file are distributed across non-adjacent clusters. The disk head must perform extra seeks to assemble the file, increasing latency. Defragmentation utilities reorder clusters to place file extents together, reducing head movement. Step-by-Step Solution: Define fragmentation: non-consecutive cluster allocation for a single file.Relate cause: repeated edits, deletions, and expansions scatter free space.State effect: more seeks → lower throughput.Identify remedy: run a defragmenter (HDD only; not beneficial for SSDs). Verification / Alternative check: Defrag tools display fragmentation maps. After defrag, files occupy longer contiguous ranges, and measured seek counts per MB drop, improving read speeds on HDDs. Why Other Options Are Wrong: Platters bad / clusters damaged: these describe physical defects (bad sectors), not fragmentation. Files corrupted: corruption affects integrity, not placement continuity. None of the above: incorrect because one option matches the definition exactly. Common Pitfalls: Defragging SSDs (unnecessary and wears flash); assuming fragmentation is the only cause of slowness (thermal throttling, malware, or low RAM can also slow systems). Final Answer: Files are not stored in consecutive clusters

Question 3

Legacy PC resources:  For classic ISA-era sound cards, which IRQ was most commonly used by default for audio devices?

Accepted Answer

Introduction / Context: Before Plug and Play standardized resource allocation, ISA expansion cards required manual configuration of I/O addresses, IRQs, and DMA channels. Sound Blaster-compatible cards had de facto defaults that avoided conflicts with serial and parallel ports. Given Data / Assumptions: We refer to legacy ISA sound cards (Sound Blaster and compatibles). Common IRQs for built-in ports: COM1 uses IRQ4; LPT1 uses IRQ7. The goal is to recall the typical default IRQ for audio. Concept / Approach: To minimize conflicts, many sound cards defaulted to IRQ5, leaving IRQ7 available for the LPT1 printer port. Some systems also allowed IRQ7, but IRQ5 became the widely used default for audio. Higher or lower IRQs were possible but less common due to conflicts or limited driver support. Step-by-Step Solution: List known defaults: COM1=IRQ4, LPT1=IRQ7.Avoid conflicts with serial/parallel by choosing a free line.Recall typical sound card default: IRQ5.Confirm in card jumpers/software setup or device manager in DOS/Windows 9x. Verification / Alternative check: Vendor manuals and DOS installers show default settings such as I/O 0x220, IRQ5, DMA1 for 8-bit audio and DMA5 for 16-bit on some models. Why Other Options Are Wrong: IRQ4: usually COM1; using it could break serial communications. IRQ7: used by LPT1 by default; sometimes used by audio but not the most common default. IRQ8: tied to the real-time clock (system), inappropriate for a sound card. None of the above: incorrect because IRQ5 is correct and common. Common Pitfalls: Assuming plug-and-play will always resolve ISA conflicts; forgetting to change both IRQ and DMA; overlooking TSRs and drivers that lock resources. Final Answer: IRQ5

Question 4

Interpreting POST codes:  On classic IBM-PC–style systems, a POST code in the 2xx range generally indicates a problem with which subsystem?

Accepted Answer

Introduction / Context: Power-On Self-Test (POST) uses numeric codes to report failures before the screen, keyboard, and drives are reliably available. Understanding the general meaning of code ranges speeds diagnosis when only beeps or hex codes are shown. Given Data / Assumptions: Classic IBM-PC/AT–style POST conventions are assumed. We are mapping the 2xx range to a subsystem category. The goal is a quick triage, not a vendor-specific microcode list. Concept / Approach: While exact mappings vary by BIOS vendor, many legacy references associate 2xx POST codes with memory subsystem checks, including RAM presence, addressing, and sometimes ROM checksum conflicts within that broader initialization phase. Practically, a 2xx code focuses attention on memory integrity and related low-level firmware validation close to memory tests. Step-by-Step Solution: Observe diagnostic beeps/hex POST display showing 2xx.Consult BIOS table: entries in this range commonly reference RAM errors or memory test faults; some include ROM verification steps.Test RAM: reseat modules, try known-good sticks, run external memory diagnostics.If ROM/firmware integrity is suspected, reflash or re-seat ROM where applicable. Verification / Alternative check: Cross-check with motherboard documentation for the exact BIOS (AMI, Award, Phoenix). Even when tables differ, 2xx almost always points near the memory test stage of POST. Why Other Options Are Wrong: Hard drive: typically tested later, after controller init. System board (generic): too broad and not specifically signaled by 2xx in most lists. Second adapter card: adapter issues usually present as later bus initialization faults. CMOS battery: low battery results in configuration loss, not a dedicated 2xx fault. Common Pitfalls: Relying on a single universal table when vendors differ; failing to isolate by removing all but essential hardware; overlooking bent DIMM pins or mixed timings that pass intermittently. Final Answer: RAM or ROM

Question 5

E-waste and disposal challenges: Among common computer components, which item is the most environmentally difficult to dispose of due to hazardous materials and specialized recycling requirements?

Accepted Answer

Introduction / Context: Electronic-waste (e-waste) handling is a critical part of IT support and sustainability. Different components contain varied materials such as plastics, ferrous and non-ferrous metals, glass, and hazardous chemicals. Understanding which items are hardest to dispose of responsibly helps technicians comply with regulations and reduce environmental harm. Given Data / Assumptions: The items considered are typical PC components: floppy drives, hard drives, power supplies, CRT monitors, and system boards. “Most difficult to dispose of” means the greatest environmental risk and most stringent handling/recycling processes. We assume standard regulatory contexts where hazardous substances require special treatment. Concept / Approach: Cathode Ray Tube (CRT) displays contain significant quantities of leaded glass, phosphor coatings, and sometimes other heavy metals. These materials classify as hazardous and require specialized recycling. Other parts (hard drives, PSUs, boards) also need proper recycling, but their hazards are generally less acute and more commonly processed by standard e-waste streams. Step-by-Step Solution: Identify components with inherently hazardous, non-trivial materials (CRTs have leaded glass and phosphors).Compare with hard drives and boards, which are recyclable for metals and do not contain large volumes of hazardous glass.Conclude that CRTs impose the greatest disposal complexity and environmental risk. Verification / Alternative check: Municipal and national recycling guidelines often list CRTs as special waste requiring certified handlers, fees, and documented processing. Many programs specifically ban landfill disposal of CRTs, confirming their disposal difficulty. Why Other Options Are Wrong: Floppy drives: Mostly metal and plastic; low hazard. Hard drives: Require data destruction but materials are readily recyclable. Power supplies: Contain capacitors and mixed metals but are routinely processed. System boards: Contain trace hazardous substances but are standard e-scrap with established refining paths. Common Pitfalls: Confusing data security concerns (hard drives) with environmental disposal difficulty; overlooking regulatory bans specific to CRTs. Final Answer: CRTs

Question 6

PCMCIA form factors: Which statement correctly describes a Type I PCMCIA card's physical characteristics and how it compares with other PCMCIA types?

Accepted Answer

Introduction / Context: Laptop expansion in the PCMCIA/PC Card era relied on standardized card thicknesses known as Type I, II, and III. Technicians should recognize each type by typical physical traits to ensure the right slot and clearance for memory, modems, or storage cards. Given Data / Assumptions: The question asks specifically about Type I cards. Comparison is with other PCMCIA types (II and III), which are thicker to accommodate ports or rotating media. Dimensions may be rounded in common references. Concept / Approach: Type I PCMCIA cards are the thinnest variant, historically specified at about 3.3 mm (often rounded to 3.5 mm in training material). Type II are roughly 5 mm and Type III about 10.5 mm thick. Type I was commonly used for memory and simple I/O; thicker types allowed connectors and larger mechanisms. Step-by-Step Solution: Recall the thickness mapping: Type I ≈ 3.3–3.5 mm, Type II ≈ 5 mm, Type III ≈ 10.5 mm.Identify the option that states Type I is the thinnest and around 3.5 mm thick.Select that statement as correct. Verification / Alternative check: Laptop service manuals and PCMCIA standards list dimension tables that confirm Type I as the thinnest profile card. Why Other Options Are Wrong: Same physical size but configured differently: Thickness differs across types. Thickest at 10.5 mm: That is Type III, not Type I. Not compatible with newest laptops: Many modern laptops removed PC Card slots entirely; compatibility depends on hardware, not the Type I definition. None of the above: Incorrect because the thinnest 3.5 mm description fits Type I. Common Pitfalls: Confusing Type I with Type II due to similar width/length; overlooking that thickness is the key differentiator among PCMCIA types. Final Answer: The thinnest PCMCIA card, measuring 3.5mm in thickness

Question 7

Upgradability of system boards: For maximum processor performance today and better future compatibility, which motherboard/bus architecture is the best candidate for CPU upgrades?

Accepted Answer

Introduction / Context: Motherboard bus architecture influences processor upgrade paths, peripheral bandwidth, and long-term support options. Choosing an architecture commonly used across multiple generations generally provides the widest availability of compatible CPUs and chipsets for upgrades. Given Data / Assumptions: We compare legacy buses: ISA and EISA, and the more modern PCI which became mainstream. “Maximum performance and future compatibility” implies broader chipset/CPU options and peripheral support. “ML” is not a standard PC system-board bus in this context. Concept / Approach: ISA and EISA are older parallel buses with limited throughput and fading CPU/chipset support. PCI became the dominant expansion standard for many years, aligning with newer chipsets and CPUs, thus offering better upgrade prospects. Therefore, a PCI-based board is the most viable candidate for processor upgrades and overall forward compatibility in the eras where these choices overlap. Step-by-Step Solution: Eliminate ISA/EISA due to age and limited modern chipset support.Note that PCI accompanied multiple CPU generations, enabling better upgrade options.Select PCI as the best choice. Verification / Alternative check: Historical platform transitions (e.g., Pentium-class systems onward) standardized on PCI for expansion, with wide availability of boards and CPU families, confirming PCI's upgrade friendliness versus ISA/EISA platforms. Why Other Options Are Wrong: ML: Not a recognized mainstream PC bus standard here. ISA/EISA: Legacy buses with limited CPU/chipset upgrade options. None of the above: Incorrect, since PCI is an appropriate answer. Common Pitfalls: Confusing expansion bus type with CPU socket type; overlooking chipset constraints that also limit upgrades even on PCI boards. Final Answer: PCI

Question 8

Bus compatibility: True or False – An ISA expansion card can be physically installed and used in an EISA motherboard slot.

Accepted Answer

Introduction / Context: EISA (Extended ISA) was designed to be backward compatible with ISA cards. Understanding physical and electrical compatibility helps technicians plan upgrades and reuse legacy peripherals where practical. Given Data / Assumptions: An EISA slot includes connectors that accept ISA cards. We consider standard, properly keyed cards without mechanical damage. System BIOS and OS support are assumed for basic functionality. Concept / Approach: EISA preserves ISA signaling and timing to allow legacy ISA cards to function in EISA slots. Therefore, an ISA device can be placed in an EISA slot and typically works as it would in an ISA system, although EISA-specific features are not utilized by the ISA card. Step-by-Step Solution: Check slot keying: EISA accommodates ISA boards mechanically.Confirm electrical compatibility: EISA implements ISA signals.Conclude the statement is true. Verification / Alternative check: Motherboard manuals from the EISA era document ISA card support in EISA slots, reinforcing backward compatibility as a design goal. Why Other Options Are Wrong: False: Contradicts the backward-compatibility feature built into EISA. Common Pitfalls: Assuming performance improves merely by using an EISA slot; ISA cards still operate at ISA speeds and capabilities. Final Answer: True

Question 9

Electrostatic discharge (ESD) handling: Which action is most likely to cause ESD damage to an integrated circuit (IC) during handling and storage?

Accepted Answer

Introduction / Context: Electrostatic discharge can silently damage semiconductor junctions, leading to latent failures. Correct packaging and grounding practices are essential for safe handling of ICs and boards in service environments. Given Data / Assumptions: We are evaluating common handling/storage actions. Non-conductive plastics can accumulate static charge. Grounded work surfaces and chassis provide safe discharge paths. Concept / Approach: ESD control relies on dissipating charge safely. Non-conductive (insulating) bags hold static and can discharge into IC pins. By contrast, grounded mats and touching a grounded chassis equalize potential, reducing ESD risk. Power sags are a power-quality issue, not ESD. Step-by-Step Solution: Identify which option promotes charge buildup (non-conductive bag).Recognize grounded practices reduce potential differences.Select the action most likely to cause ESD: storing ICs in non-conductive plastic bags. Verification / Alternative check: ESD standards recommend antistatic shielding or dissipative bags, ESD-safe mats, and wrist straps. Insulating packaging is explicitly discouraged for unprotected semiconductors. Why Other Options Are Wrong: Grounded mat: Mitigates ESD. Power sags: Affect uptime, not static discharge into ICs. Touching grounded chassis: Helps drain charge before handling parts. None of the above: Incorrect because one action clearly increases ESD risk. Common Pitfalls: Using common plastic zip bags instead of antistatic bags; forgetting to wear a wrist strap; handling by pins instead of edges. Final Answer: Placing an IC in a non-conductive plastic bag

Question 10

PC diagnostics: Which component failure most commonly triggers a “parity error” message during system operation or POST?

Accepted Answer

Introduction / Context: Parity errors historically occur when memory parity checks detect a mismatch between stored and checked bits. Recognizing the most likely culprit speeds troubleshooting during boot failures, intermittent crashes, or POST beeps. Given Data / Assumptions: The system uses memory with parity or ECC checking enabled. POST or the OS reports a parity error. Other subsystems (storage, controllers) are otherwise normal. Concept / Approach: Parity or ECC mechanisms validate RAM integrity. A parity error indicates that at least one data bit does not match the stored parity, pointing directly to faulty RAM modules or memory subsystem issues (socket, trace, timing). While software bugs can cause crashes, they do not cause hardware parity mismatches at the physical memory level. Step-by-Step Solution: Associate “parity error” with memory integrity checking features.Identify faulty RAM as the prime suspect.Select “bad RAM” as the correct answer. Verification / Alternative check: Swapping DIMMs, running memory diagnostics, reseating modules, or testing one stick at a time commonly isolates the failing memory, confirming the diagnosis. Why Other Options Are Wrong: Hard disk/controller: Cause I/O errors, not RAM parity mismatches. Bad software: May crash the system but does not trigger hardware parity failure codes. None of the above: Incorrect, as RAM is the typical cause. Common Pitfalls: Ignoring motherboard slots and timings; mixing mismatched modules; overlooking oxidized contacts causing intermittent parity errors. Final Answer: bad RAM

Question 11

Storage performance comparison: For accessing large video files rapidly on a legacy workstation, which storage option typically offers the fastest sustained throughput?

Accepted Answer

Introduction / Context: Video editing and playback stress storage I/O, especially with large sequential reads and writes. Historically, workstation-class systems leveraged faster buses and multi-drive arrays to achieve required throughput and reliability. Given Data / Assumptions: We compare legacy storage: optical, IDE/EIDE, and SCSI hard drives. Workload is large video files, implying high sustained data rates. We assume typical drives from the same era. Concept / Approach: SCSI historically provided higher bus bandwidth, better command queuing, multi-device support, and enterprise-grade drive mechanics, resulting in superior sustained transfer rates compared with contemporary IDE/EIDE and far exceeding optical media. Therefore, SCSI hard drives are the preferred option for speed in that context. Step-by-Step Solution: Eliminate optical drives due to low sustained throughput.Compare IDE/EIDE with SCSI; SCSI offers higher performance and better multitasking.Select SCSI hard drives as fastest for large file access. Verification / Alternative check: Benchmarks from the era consistently show SCSI outperforming IDE/EIDE in sustained transfer and access times, especially in multi-user or heavy I/O scenarios. Why Other Options Are Wrong: Optical: Limited by disc speed and seek latency. IDE/EIDE: Consumer-oriented; slower command processing versus SCSI peers. None of the above: Incorrect, as SCSI is a valid, superior choice here. Common Pitfalls: Confusing bus potential with actual drive mechanics; assuming modern SATA behavior when discussing legacy IDE/SCSI performance. Final Answer: SCSI hard drives

Question 12

DOS upgrades and compatibility: Which of the following is LEAST likely to interfere with upgrading a PC to a newer DOS version?

Accepted Answer

Introduction / Context: Upgrading legacy DOS often involved checking hardware compatibility, storage configurations, and third-party utilities. Identifying what does not hinder an upgrade saves time and reduces risk. Given Data / Assumptions: We consider typical obstacles: BIOS limitations, video compatibility, and disk compression utilities. Backup files are ordinary data files placed by users or backup programs. Goal is a smooth DOS version upgrade on the same machine. Concept / Approach: BIOS versions and video hardware can affect boot loaders, memory layout, and drivers. Compressed drives depend on specific drivers that must load early and can complicate upgrades. In contrast, the presence of backup files is benign; they do not alter boot or DOS core behavior. Step-by-Step Solution: List potential blockers: firmware constraints, driver dependencies, disk compression layers.Identify harmless items: user backup files do not affect boot or DOS installation logic.Select “Existing backup files” as least likely to interfere. Verification / Alternative check: Historical upgrade guides recommend checking BIOS and compression utilities; they never cite benign data files as blockers, aligning with this choice. Why Other Options Are Wrong: ROM BIOS: May require updates; limits features like large disk access. Video controller: May require compatible drivers or modes. Compressed drives: Tight coupling to boot sequence; can break if mishandled. None of the above: Incorrect, as one option clearly is least problematic. Common Pitfalls: Attempting an upgrade without disabling or updating compression drivers; ignoring BIOS limits for disk geometry. Final Answer: Existing backup files

Question 13

Basic hardware check: When measuring a typical internal PC speaker with an ohmmeter (disconnected from the circuit), which resistance value is most appropriate to expect?

Accepted Answer

Introduction / Context: Technicians sometimes verify small speakers with a multimeter to ensure the voice coil is intact. The reading provides a quick check before deeper audio troubleshooting. Given Data / Assumptions: The internal PC speaker or small transducer is disconnected prior to measurement. We expect a finite, low DC resistance for a good voice coil. Nominal impedances for small speakers are typically 4, 8, or 16 ohms (AC impedance at audio frequencies), with DC resistance somewhat lower but in the same range. Concept / Approach: A healthy dynamic speaker presents a small, nonzero resistance when measured with DC. Although its rated impedance is specified at AC, the DC resistance is typically a bit less than that rating. Among the choices, 16 ohms is the only reasonable finite value in the expected range. Values like a negative resistance, “Q Ohms,” or infinite (open circuit) would indicate measurement error or a blown coil. Step-by-Step Solution: Disconnect the speaker to avoid parallel circuit paths.Measure resistance across the terminals with the ohmmeter.Interpret a finite low reading near the rated impedance as good; choose 16 ohms from the options provided. Verification / Alternative check: An audio test with a function generator or motherboard beep confirms operation; an open coil reads very high resistance and produces no sound. Why Other Options Are Wrong: Q Ohms: Nonsensical value. -200 Ohms: Negative resistance is not applicable here. Unlimited Ohms: Indicates an open, failed coil. None of the above: Incorrect because 16 ohms is plausible and correct among the options. Common Pitfalls: Measuring in-circuit leading to misleading values; confusing rated impedance with DC resistance; not disconnecting power before testing. Final Answer: 16 Ohms

Question 14

Fuse continuity test: When checking a 2 A fuse with a multimeter set to measure resistance (Ohms), what reading indicates a good fuse element (i.e., intact conductor)?

Accepted Answer

Introduction / Context: Fuses protect circuits by opening under excessive current. A basic bench check for a fuse is a continuity or resistance test. Understanding the expected reading prevents unnecessary replacements and speeds diagnostics. Given Data / Assumptions: The fuse is removed from the circuit and measured directly. The meter measures resistance between fuse end caps. We assume a standard intact fuse with a low-resistance metal element. Concept / Approach: A good fuse is simply a short piece of wire designed to melt at a specified current. Its resistance is extremely low. An ideal measurement trends to 0 ohms. Real meters may show a few tenths of an ohm due to lead resistance, but the conceptual target is 0 ohms to indicate continuity. High or infinite resistance indicates a blown fuse. Step-by-Step Solution: Remove the fuse to avoid parallel paths.Zero or compensate meter leads if possible.Measure across the fuse: a good fuse reads ~0 ohms, represented by 0.0 in the choices. Verification / Alternative check: Use the continuity mode: a steady tone confirms a low-resistance path. Visually inspecting the fuse element can corroborate the measurement but is less reliable for slow-blow types. Why Other Options Are Wrong: 2.0 or 5.0 ohms: Too high for a healthy fuse, implying resistance where there should be near-zero. 0.2 ohm: Could reflect lead resistance, but the best conceptual answer is 0.0 among the given discrete choices. None of the above: Incorrect since 0.0 represents a good fuse. Common Pitfalls: Measuring in-circuit leading to misleading readings; not zeroing test leads; confusing continuity tone thresholds with actual resistance values. Final Answer: 0.0

Question 15

USB fundamentals for PC technicians How many peripheral devices can be addressed on a single USB host controller or hub tree (USB logical bus), excluding the host itself?

Accepted Answer

Introduction / Context: Universal Serial Bus (USB) is ubiquitous for connecting keyboards, mice, storage, and many other peripherals. Technicians frequently need to know the addressing limits of a single USB host controller when planning hub deployments and troubleshooting enumeration issues. Given Data / Assumptions: The question concerns the logical addressing capacity of one USB host controller tree (root hub plus downstream hubs and devices). USB specification reserves address 0 during enumeration. Counting refers to total device addresses, including hubs and functions, not the number of physical ports on any one hub. Concept / Approach: Per the classic USB design (USB 1.x/2.0), the bus provides 7-bit addresses for devices. One address is reserved for the default state during setup, leaving a maximum of 127 usable addresses for attached functions and hubs on a single logical bus. Step-by-Step Solution: Note that USB addressing supports up to 128 total values (0–127).Address 0 is used temporarily during enumeration.Therefore, the number of assignable device addresses is 127. Verification / Alternative check: Hub planning guidelines and certification tests reference the 127-device limit per host controller tree, confirming this capacity independent of physical port counts. Why Other Options Are Wrong: 125 and 100 are arbitrary and below the specification limit. 225 exceeds the address space. “None of the above” is incorrect because 127 is a standard, well-known value. Common Pitfalls: Confusing the number of physical hub ports with the total logical device limit; forgetting that hubs themselves consume addresses; assuming multiple root ports on a motherboard share the same logical bus when each host controller has its own 127-device capacity. Final Answer: 127.

Question 16

PC hardware interrupts What is the standard IRQ line used by the legacy PC floppy disk controller (FDC)?

Accepted Answer

Introduction / Context: On legacy ISA/AT-class PCs, hardware devices signal the CPU via Interrupt Request (IRQ) lines. Knowing the canonical IRQ assignments helps diagnose conflicts and misconfigurations on older systems or embedded setups derived from them. Given Data / Assumptions: Legacy hardware model: ISA-based IRQ mapping. Device in question: floppy disk controller (FDC), handling drives like A: and B:. We assume default PC/AT assignments without custom remapping. Concept / Approach: Historically standardized IRQ usage assigns IRQ 6 to the floppy controller, IRQ 14 to primary IDE, IRQ 4 and 3 to COM1/COM3 and COM2/COM4 respectively, and IRQ 1 to the keyboard controller, among others. These defaults informed BIOS and OS drivers for decades. Step-by-Step Solution: Identify the device: floppy disk controller.Recall standard IRQ table: FDC uses IRQ 6.Select IRQ 6 as the correct answer. Verification / Alternative check: Motherboard manuals and OS hardware lists consistently show the floppy controller on IRQ 6 unless explicitly changed. Why Other Options Are Wrong: IRQ 9 commonly supported ACPI or cascaded PIC functions; IRQ 10 was often free or used by expansion cards. “All of the above” contradicts the single-standard assignment for the FDC. Common Pitfalls: Confusing IRQ 6 (FDC) with IRQ 7 (LPT1) or IRQ 5 (often sound/LPT2) and mixing serial-port IRQs (3/4). Final Answer: 6.

Question 17

Binary data basics for support technicians How many bits constitute one byte in modern computing practice?

Accepted Answer

Introduction / Context: Understanding digital units is fundamental for storage, networking, and diagnostics. The byte is the standard atomic unit for addressing and memory operations across virtually all contemporary platforms. Given Data / Assumptions: The question refers to the conventional definition used in modern architectures and standards. Historical exceptions (e.g., 6-bit or 9-bit bytes) are not in scope for today’s PCs. Concept / Approach: A byte equals 8 bits. This standardization underpins octet-based networking (OSI, IP), character encodings (ASCII, UTF-8), and memory buses. Eight bits allow values from 0 to 255, enabling compact representation of characters and small integers. Step-by-Step Solution: Recall the modern byte definition: 8 bits.Relate to familiar ranges: 8-bit value range is 0–255.Select the option that states “8.” Verification / Alternative check: Standards such as RFCs use the term “octet” explicitly to denote 8 bits, reinforcing the equivalence with byte in most contexts. Why Other Options Are Wrong: 16 and 10 describe word sizes in some contexts, not bytes. 255 is the maximum 8-bit unsigned value, not a count of bits. “2 to the 9th power” equals 512 and is unrelated to a byte's bit count. Common Pitfalls: Confusing the 8-bit value range (0–255) with the number of bits; conflating historical non-standard “byte” sizes with the modern definition. Final Answer: 8.

Question 18

Power quality terminology What is a brownout in electrical supply terms for IT equipment?

Accepted Answer

Introduction / Context: Properly identifying power anomalies helps select protection gear (UPS, line conditioners) and troubleshoot intermittent computer failures. Among sags, surges, blackouts, and brownouts, each has different implications for electronics. Given Data / Assumptions: We are using standard power-quality definitions used by facilities and IT. Duration is long enough to affect device operation but not a total loss of power. Concept / Approach: A brownout is a sustained or semi-sustained reduction in RMS line voltage below nominal, often due to grid load. It is more pronounced and longer than a transient “sag,” but it is not a complete outage (blackout). Brownouts can cause undervoltage stress, data errors, and motor overheating. Step-by-Step Solution: Map each term: surge (overvoltage), sag (brief undervoltage), brownout (extended undervoltage), blackout (zero voltage).Match description “slightly decreased voltage lasting seconds to minutes” with brownout.Choose the corresponding option. Verification / Alternative check: UPS vendor documentation and power quality standards define brownouts as sustained undervoltage, frequently mitigated by line-interactive or online UPS topologies. Why Other Options Are Wrong: Elevated voltage describes overvoltage/surge. Complete outage is a blackout. Rapid cycling is different from sustained undervoltage. The statement dismissing electricity is irrelevant. Common Pitfalls: Confusing transient sags with brownouts; assuming a surge protector solves brownouts (it usually does not), whereas a UPS with AVR (automatic voltage regulation) helps. Final Answer: A slightly decreased voltage lasting seconds to minutes or more.

Question 19

Classic Macintosh troubleshooting A dialog box with a “bomb” icon appears on a Macintosh screen. What kind of fault does this most commonly indicate?

Accepted Answer

Introduction / Context: Classic Mac OS versions (pre–Mac OS X) displayed a “bomb” dialog to indicate a system or application error. Recognizing the icon and its meaning speeds triage when supporting legacy systems or analyzing historical crash reports. Given Data / Assumptions: We refer to the classic Mac OS error dialog, not modern macOS kernel panics. Bomb dialog appears during a crash or unhandled exception. Concept / Approach: The bomb dialog signified a software exception, API misuse, extension conflicts, or system corruption causing the OS to halt the application (or system). While bad RAM can indirectly cause crashes, the bomb icon itself denotes a software-level fault handling, not a hardware diagnostic. Step-by-Step Solution: Identify the symbol: classic bomb dialog.Recall Apple documentation: bomb = system/application error.Select “software problem.” Verification / Alternative check: Historic Apple tech notes and user guides associate bomb dialogs with system errors, prompting restart or providing an error code. Why Other Options Are Wrong: RAM and ROM hardware faults may cause instability but are not uniquely indicated by the bomb icon. ADB issues affect peripherals, not system crash indication per se. “None of the above” is invalid. Common Pitfalls: Assuming any crash equals bad hardware; overlooking extension conflicts and OS version mismatches common in old Mac environments. Final Answer: A software problem (system or application crash).

Question 20

Inkjet printer principles In continuous-inkjet style deflection systems, what component deflects the droplets to form characters or images?

Accepted Answer

Introduction / Context: Inkjet printers use different mechanisms. Two major categories are continuous inkjet (CIJ) and drop-on-demand (thermal or piezo). CIJ systems charge droplets and steer them electrostatically; drop-on-demand ejects droplets only where needed. Given Data / Assumptions: The question specifically describes droplet deflection, a hallmark of CIJ technology. Consumer printers more often use drop-on-demand, but industrial CIJ remains common for coding/marking. Concept / Approach: In CIJ, a continuous stream of ink is broken into droplets by a vibration source. Selected droplets are electrically charged and pass through deflection plates with an applied electric field, steering them onto the substrate while uncharged droplets may be caught and recirculated. Thus, the deflection element is the set of charged plates. Step-by-Step Solution: Identify technology: “deflected droplets” implies CIJ.Recall CIJ anatomy: charging electrode + deflection plates.Choose “Electrically charged plates.” Verification / Alternative check: Industrial CIJ manuals describe deflection voltages and charge modulation to position droplets, confirming the mechanism. Why Other Options Are Wrong: Multidirectional nozzles are not how CIJ steers drops. High pressure is used to form the stream but does not by itself provide precise deflection. “All of the above” conflicts with the specific CIJ principle. Common Pitfalls: Confusing CIJ with thermal/piezo drop-on-demand used in home printers; assuming pressure alone can paint accurate characters at speed without electrostatic steering. Final Answer: Electrically charged plates.

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