Integrated-circuit packaging: An IC package that has two parallel rows of through-hole pins on opposite sides is commonly called a ________.

Introduction / Context:
Understanding package styles helps with PCB selection, breadboarding, and prototyping. One of the most common legacy through-hole packages has two rows of pins suited to sockets and breadboards.

Given Data / Assumptions:

• Package has two parallel rows of pins.
• Through-hole form factor is implied.
• We identify the industry-standard name.

Concept / Approach:
DIP stands for Dual In-line Package. It features two rows of pins spaced typically at 2.54 mm (0.1 in) pitch, suitable for through-hole mounting and sockets. Other options listed are different families or surface-mount styles.

Step-by-Step Solution:
Match description: “two rows of parallel connecting pins” → dual in-line.Choose the standardized term → DIP.Confirm: DIPs are widely used in classic TTL/CMOS ICs (e.g., 7400, 555 timer).

Verification / Alternative check:
Compare with surface-mount packages: TSSOP (thin shrink small-outline) and QFP (quad flat package) are SMT, not through-hole; CMOS is a technology, not a package; BGA uses solder balls on the underside.

Why Other Options Are Wrong:
QFP/TSSOP/BGA: Surface-mount packages; pin layouts do not match dual in-line through-hole.CMOS: Refers to transistor technology, not a package style.

Common Pitfalls:
Mixing technology (TTL/CMOS) with package types, or confusing SOIC/TSSOP (two rows, but SMT gull-wing leads) with true through-hole DIP.

Final Answer:
DIP