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Logic Families and Their Characteristics problems


  • 1. Special handling precautions should be taken when working with MOS devices. Which of the following statements is not one of these precautions?

  • Options
  • A. All test equipment should be grounded.
  • B. MOS devices should have their leads shorted together for shipment and storage.
  • C. Never remove or insert MOS devices with the power on.
  • D. Workers handling MOS devices should not have grounding straps attached to their wrists.
  • Discuss
  • 2. Can a 74HCMOS logic gate directly connect to a 74ALSTTL gate?

  • Options
  • A. Yes
  • B. No
  • Discuss
  • 3. How is the speed?power product of a logic family determined?

  • Options
  • A. The propagation delay in µs is multiplied by the power dissipation in mW.
  • B. The propagation delay in ms is multiplied by the power dissipation in µW.
  • C. The propagation delay in ns is multiplied by the power dissipation in mW.
  • D. The propagation delay in ns is multiplied by the power dissipation in µW.
  • Discuss
  • 4. As a general rule, the lower the value of the speed?power product, the better the device because of its:

  • Options
  • A. long propagation delay and high power consumption
  • B. long propagation delay and low power consumption
  • Discuss
  • 5. Which logic family is characterized by a multiemitter transistor on the input?

  • Options
  • A. ECL
  • B. CMOS
  • C. TTL
  • D. None of the above
  • Discuss
  • 6. From the following specifications determine the fan-out for the logic family.
    Digital Electronics Logic Families and Their Characteristics: From the following specifications determine the fan-out for the logic family.

  • Options
  • A. HIGH state is 16, LOW state is 8
  • B. HIGH state is 8, LOW state is 16
  • C. HIGH state is 4, LOW state is 8
  • D. HIGH state is 8, LOW state is 4
  • Discuss
  • 7. What is unique about TTL devices such as the 74SXX?

  • Options
  • A. These devices use Schottky transistors and diodes to prevent them from going into saturation; this results in faster turn-on and turn-off times, which translates into higher frequency operation.
  • B. The gate transistors are silicon (S), and the gates therefore have lower values of leakage current.
  • C. The S denotes the fact that a single gate is present in the IC rather than the usual package of 2?6 gates.
  • D. The S denotes a slow version of the device, which is a consequence of its higher power rating.
  • Discuss
  • 8. Why must CMOS devices be handled with care?

  • Options
  • A. so they don't get dirty
  • B. because they break easily
  • C. because they can be damaged by static electricity discharge
  • Discuss
  • 9. Totem-pole outputs ________ be connected ________ because ________.

  • Options
  • A. can, in parallel, sometimes higher current is required
  • B. cannot, together, if the outputs are in opposite states excessively high currents can damage one or both devices
  • C. should, in series, certain applications may require higher output voltage
  • D. can, together, together they can handle larger load currents and higher output voltages
  • Discuss
  • 10. A TTL totem-pole circuit is designed so that the output transistors:

  • Options
  • A. are always on together
  • B. provide linear phase splitting
  • C. provide voltage regulation
  • D. are never on together
  • Discuss

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