PCB assembly methods Compared to through-hole mounting, what is typically true about the need for drilled holes when using surface-mount technology (SMT) on printed circuit boards?

Introduction / Context:
PCB manufacturing differs for through-hole and surface-mount assembly. Understanding hole requirements helps reduce cost, improve density, and select appropriate components and processes.

Given Data / Assumptions:

• SMT components are soldered to pads on the PCB surface.
• Through-hole parts require plated through-holes for leads.
• Mechanical mounting or connectors may still require some holes.

Concept / Approach:
Because SMT parts do not pass leads through the board, most signal pads do not require drilling. Vias may still exist for inter-layer connectivity, but component-lead holes become largely unnecessary, enabling denser layouts and smaller boards.

Step-by-Step Solution:
Identify assembly type: SMT.Assess need for drilling: no lead-through holes for most components.Conclusion: component holes are usually unnecessary, though mounting and connectors may still use some.

Verification / Alternative check:
Modern high-density designs use almost exclusively SMT, reserving through-hole for connectors or high-stress parts.

Why Other Options Are Wrong:
“Smaller”/“larger”/“same size”: misunderstand the main point; SMT largely eliminates component holes.

Common Pitfalls:
Confusing component holes with vias; vias are still used extensively even in SMT boards.

Final Answer:
usually unnecessary