Electrostatic discharge (ESD) handling: Which action is most likely to cause ESD damage to an integrated circuit (IC) during handling and transport?

Introduction / Context:
ESD is a silent killer of sensitive semiconductor junctions. Proper packaging and handling practices prevent latent defects and immediate device failure.

Given Data / Assumptions:

• We are handling loose ICs or boards.
• Packaging may be insulating, dissipative, or conductive.
• Grounding practices are available (mats, wrist straps).

Concept / Approach:

Non-conductive (insulating) plastic can accumulate high static charge. Placing ICs in such bags risks sudden discharge into device pins. Proper ESD packaging is conductive or static dissipative, which equalizes charge slowly and safely. Grounded mats and chassis touch (after proper connection to earth/ESD ground) help drain body charge.

Step-by-Step Solution:

Verification / Alternative check:

ESD control standards (ANSI/ESD S20.20) recommend dissipative or conductive packaging and grounded workstations. Insulating plastics are discouraged for sensitive devices.

Why Other Options Are Wrong:

• Grounded mat and chassis touch: reduce potential difference.
• Repeated sags in current: that is a power-quality issue, not ESD.
• None of the above: incorrect since the insulating bag is a known hazard.

Common Pitfalls:

Confusing pink anti-static (dissipative) with plain clear plastic; forgetting to ground oneself before handling parts; mixing ESD-safe and non-ESD bags.

Final Answer:

Placing an IC in a non-conductive plastic bag