Microwave resistors — why very small wall (film) thickness? In practical microwave resistors (e.g., thin-film or resistive cards), the conductive film or wall thickness is made as small as possible primarily to:

Difficulty: Easy

Correct Answer: reduce inductance

Explanation:


Introduction / Context:
At microwave frequencies, any conductor behaves not only as a resistor but also as an inductor and capacitor due to geometry and current distribution (skin effect). For resistive elements used as terminations or absorbers, parasitic reactances degrade broadband matching. Minimizing these parasitics is central to good RF performance.


Given Data / Assumptions:

  • Resistive element implemented as a thin film or resistive card in a waveguide or microstrip.
  • Goal: achieve broadband, nonreactive resistance close to the target value.
  • Operating in the microwave regime where skin depth is small.


Concept / Approach:
Parasitic inductance arises from loop area and current path thickness/length. A thinner conductive layer shortens current path height and lowers stored magnetic energy, thus reducing series inductance. While sheet resistance can be set by material resistivity and film thickness, the primary microwave rationale for thin walls/films is to reduce inductive reactance so the part behaves resistively over a wider band. Excess thickness can also aggravate discontinuities and excite higher-order fields.


Step-by-Step Solution:

Identify microwave error sources: series L and shunt C.Reduce L by minimizing film thickness and loop area.Select sheet resistance (ohms/square) via material and geometry to hit the desired R value without resorting to thick, inductive conductors.


Verification / Alternative check:
Thin-film attenuators and terminations specify low VSWR across band when implemented with very thin resistive layers and tapered geometries, confirming inductance reduction benefits.


Why Other Options Are Wrong:

  • High/low R alone miss the RF reason; R can be achieved with geometry. The thinness target is primarily to curb inductance.
  • Maximize capacitive effect is counterproductive; designers minimize C as well via layout.


Common Pitfalls:
Assuming DC resistance selection forces thick films; at RF, parasitics dominate and must be minimized for flat response.


Final Answer:
reduce inductance

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