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In manufacturing, which process is typically used to fabricate a microstrip transmission line on a dielectric substrate?

Difficulty: Easy

Correct Answer: printed circuit technique

Explanation:


Introduction / Context:
Microstrip lines are planar RF interconnects realized on PCB or hybrid substrates. Their fabrication parallels printed circuit board processes to define controlled-impedance traces.


Given Data / Assumptions:

  • Standard copper cladding on dielectric (e.g., FR-4, Rogers).
  • Patterning via photolithography and chemical etching.


Concept / Approach:
The umbrella term 'printed circuit technique' covers imaging the trace (photoresist), UV exposure through a mask, development, and chemical etching—often called photo-etching as a step in the printed circuit process. In industry, one describes the overall approach as the printed circuit technique.


Step-by-Step Solution:

Start with copper-clad substrate.Apply photoresist, expose pattern, develop.Etch away unwanted copper to leave the microstrip line.


Verification / Alternative check:
RF PCB houses implement microstrip/CPW structures using standard PCB photolithography and etching flows.


Why Other Options Are Wrong:

Oxidation/cladding/electroplating alone are materials steps, not the full patterning/fabrication method for the line geometry.'Photo etching' is a step, but the accepted holistic process name is 'printed circuit technique'.


Common Pitfalls:

Equating a single step (etching) with the entire manufacturing process nomenclature.


Final Answer:

printed circuit technique
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