CMOS package types in practice Which packaging options are commonly available for CMOS logic ICs in standard product lines?

Introduction / Context:
Integrated circuit packaging affects assembly method, prototyping approach, and thermal behavior. CMOS logic families have been produced for decades in both through-hole and surface-mount forms to suit diverse manufacturing flows.

Given Data / Assumptions:

• DIP (Dual In-line Package) is through-hole; SOIC (Small-Outline IC) is surface-mount.
• We are considering common catalog offerings for CMOS logic.
• Specialized packages (TSSOP, QFN) also exist but are outside this question.

Concept / Approach:
Standard CMOS logic devices (e.g., 74HC/74HCT, CD4000 series) are widely available in DIP for breadboarding and education, and in SOIC for modern automated assembly. Thus, both packaging styles are typical and expected in inventory.

Step-by-Step Reasoning:
Check historical availability: CD4000 and 74HC families offered in DIP.Check SMD prevalence: SOIC versions of the same logic functions are mainstream.Therefore, the correct choice is “DIP and SOIC configurations.”

Verification / Alternative check:
Vendor parametric searches routinely list both DIP and SOIC variants for common logic gates and flip-flops, confirming dual availability.

Why Other Options Are Wrong:

• DIP-only or SOIC-only artificially restricts what is widely available.
• “Neither” contradicts decades of CMOS packaging practice.

Common Pitfalls:

• Assuming through-hole is obsolete; while less common in mass production, DIP remains common in labs and education.
• Ignoring that many pin-compatible parts exist across multiple packages.

Final Answer:
DIP and SOIC configurations