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Home Digital Electronics Integrated-Circuit Logic Families Comments

  • Question
  • The power dissipation of a CMOS IC will ________.


  • Options
  • A. decrease with frequency
  • B. increase with gate size
  • C. decrease with gate size
  • D. increase with frequency

  • Correct Answer
  • increase with frequency 


  • Integrated-Circuit Logic Families problems


    Search Results


    • 1. The HIGH logic level for a standard TTL output must be at least ________.

    • Options
    • A. 2.4 V
    • B. 2 V
    • C. 0.8 V
    • D. 5 V
    • Discuss
    • 2. The number of gates that can be connected to a single output without exceeding the current ratings of the gate is called ________.

    • Options
    • A. fan-out
    • B. propagation
    • C. dissipation
    • D. SSI
    • Discuss
    • 3. The output current for a LOW output is called a(n) ________.

    • Options
    • A. sink current
    • B. ground current
    • C. exit current
    • D. fan-out
    • Discuss
    • 4. A logic probe is placed on the output of a digital circuit and the probe lamp is dimly lit. This display indicates ________.

    • Options
    • A. that an open or bad logic level exists
    • B. a high level output
    • C. a high-frequency pulse train
    • D. that the supply voltage is low
    • Discuss
    • 5. In a DIP the spacing between pins is typically ________.

    • Options
    • A. 5 mils
    • B. 10 mils
    • C. 50 mils
    • D. 100 mils
    • Discuss
    • 6. The minimum input voltage recognized as HIGH by a TTL gate is ________.

    • Options
    • A. 2.0 V
    • B. 2.4 V
    • C. 0.8 V
    • D. 5.0 V
    • Discuss
    • 7. When the outputs of several open-collector TTL gates are connected together, the gate outputs ________.

    • Options
    • A. usually burn out
    • B. produce more voltage
    • C. are ANDed together
    • D. produce more fan-out
    • Discuss
    • 8. The ________ is defined as the maximum number of standard logic inputs that an output can drive reliably.

    • Options
    • A. fan-drive
    • B. fan-out
    • C. fan-in
    • D. open-collector
    • Discuss
    • 9. The propagation delay of standard TTL gates is approximately ________.

    • Options
    • A. 2 µs
    • B. 1 µs
    • C. 4 ns
    • D. 10 ns
    • Discuss
    • 10. The 74F-Fast TTL integrated-circuit fabrication technique uses reduced interdevice ________ to achieve reduced propagation delays.

    • Options
    • A. noise
    • B. resistance
    • C. capacitance
    • D. inductance
    • Discuss


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