Fast TTL (74F) speed improvement mechanism: Which interdevice parasitic is primarily reduced in 74F “Fast TTL” processes to achieve shorter propagation delays?

Difficulty: Easy

Correct Answer: capacitance

Explanation:


Introduction / Context:
Speed in logic families improves when internal parasitics are reduced. For fast TTL variants (such as 74F), process and layout techniques reduce capacitive loading, enabling faster charge/discharge and therefore shorter delays.



Given Data / Assumptions:

  • Propagation delay is impacted by RC time constants in signal paths.
  • Reducing C (capacitance) directly reduces RC, accelerating edges.
  • 74F family targets faster switching than standard TTL.


Concept / Approach:
The τ (time constant) of a node is roughly R * C. For a given drive resistance R, reductions in capacitance C (via smaller junctions, tighter layouts, different dielectric) provide a direct reduction in propagation delay. While resistance and inductance matter, the dominant lever in these families is reducing capacitance.



Step-by-Step Solution:

Relate delay to RC: tp ∝ R * C.Identify which parasitic is emphasized in 74F: capacitance reductions.Therefore, “capacitance” is the correct choice.


Verification / Alternative check:

Datasheets show significantly reduced tpHL/tpLH in 74F; process notes highlight lower capacitances.


Why Other Options Are Wrong:

noise: A symptom/metric, not the root parasitic tuned.resistance: Also relevant, but in 74F the hallmark is reduced capacitance loads.inductance: Matters for very fast edges/packaging, but not the primary 74F lever.


Common Pitfalls:

Assuming “noise” reduction equals speed improvement; causality is via parasitics and device physics.Overlooking the RC time constant model.


Final Answer:

capacitance

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