Safe handling of CMOS devices — ESD and operational precautions Which set of precautions correctly applies to handling and operating CMOS integrated circuits?

Introduction / Context:
CMOS inputs are insulated-gate structures that are highly susceptible to electrostatic discharge and overvoltage. Good lab practice and ESD control prevent catastrophic and latent failures that otherwise look like random faults later in production or field use.

Given Data / Assumptions:

• We consider common-sense handling and ESD controls in labs and manufacturing.
• We want measures that protect devices during storage, transport, and insertion.
• Hot-plugging can overstress devices due to transient conditions.

Concept / Approach:
Proper ESD practice includes grounding of work surfaces and instruments, use of antistatic materials for storage and shipping, and avoiding hot insertion into powered sockets. These steps limit voltage differentials and charge accumulation that could punch through thin gate oxides or forward-bias diodes into destructive conduction.

Step-by-Step Solution:

Verification / Alternative check:
Industry ESD standards (e.g., ANSI/ESD S20.20) recommend these exact measures for MOS devices.

Why Other Options Are Wrong:
Each individual precaution is correct; only the combined “All of the above” fully answers the question.

Common Pitfalls:
Assuming that on-chip protection diodes remove the need for ESD controls; they improve robustness but are not fail-proof.

Final Answer:
All of the above.