In resistor networks packaged as SIP (single in-line package) or DIP (dual in-line package) resistor arrays, which technology is most commonly used for the integrated resistors?

Introduction / Context:
SIP and DIP resistor networks are compact packages that house multiple resistors for pull-ups, pull-downs, and biasing in digital and mixed-signal designs. Knowing the underlying resistor technology helps predict tolerance, noise, and temperature behavior.

Given Data / Assumptions:

• We are discussing typical commercial SIP/DIP resistor arrays used on PCBs.
• Key tech candidates include thick film, thin/metal film, metal oxide, and wirewound.
• Goal: identify what is most commonly used in these arrays.

Concept / Approach:
Thick-film processes screen-print resistive pastes onto ceramic substrates, then laser-trim values. This method is economical, dense, and well-suited to multi-element arrays integrated inside SIP or DIP packages. Wirewound parts are physically larger and better for power applications, not multi-resistor IC-like arrays. Metal film arrays exist but are less common and costlier at the array level compared to thick film solutions.

Step-by-Step Solution:
Consider package constraints: many resistors on a small ceramic substrate.Match process: thick film enables compact, batch fabrication and trimming.Evaluate cost/performance: thick film strikes favorable balance for pull-ups and general biasing networks.Conclude: thick film is the prevalent technology in SIP/DIP resistor networks.

Verification / Alternative check:
Vendor datasheets for common resistor arrays consistently list thick-film technology, sometimes specifying resistance tolerance (e.g., 1–5%) and TCR ranges consistent with thick film compositions.

Why Other Options Are Wrong:

• Metal film: Used in precision networks but less common as the mainstream SIP/DIP array technology.
• Wirewound: Not suitable for dense arrays; used for power and low-inductance applications.
• Metal oxide: Often used for discrete resistors with good surge behavior, not typical for arrays.

Common Pitfalls:

• Assuming discrete resistor technology directly translates to arrays.
• Overlooking cost and manufacturability constraints that favor thick film.

Final Answer:
thick film