Electrostatic discharge (ESD) handling: Which action is most likely to cause ESD damage to an integrated circuit (IC) during handling and storage?

Introduction / Context:Electrostatic discharge can silently damage semiconductor junctions, leading to latent failures. Correct packaging and grounding practices are essential for safe handling of ICs and boards in service environments.

Given Data / Assumptions:

• We are evaluating common handling/storage actions.
• Non-conductive plastics can accumulate static charge.
• Grounded work surfaces and chassis provide safe discharge paths.

Concept / Approach:

ESD control relies on dissipating charge safely. Non-conductive (insulating) bags hold static and can discharge into IC pins. By contrast, grounded mats and touching a grounded chassis equalize potential, reducing ESD risk. Power sags are a power-quality issue, not ESD.

Step-by-Step Solution:

Verification / Alternative check:

ESD standards recommend antistatic shielding or dissipative bags, ESD-safe mats, and wrist straps. Insulating packaging is explicitly discouraged for unprotected semiconductors.

Why Other Options Are Wrong:

• Grounded mat: Mitigates ESD.
• Power sags: Affect uptime, not static discharge into ICs.
• Touching grounded chassis: Helps drain charge before handling parts.
• None of the above: Incorrect because one action clearly increases ESD risk.

Common Pitfalls:

Using common plastic zip bags instead of antistatic bags; forgetting to wear a wrist strap; handling by pins instead of edges.

Final Answer:

Placing an IC in a non-conductive plastic bag