There is no hysteresis phenomenon is any dielectric material. True False Hystere

CuriousTab

CuriousTab

Home Aptitude

Discussion

Home ‣ Electronics and Communication Engineering ‣ Materials and Components Comments

Question
There is no hysteresis phenomenon is any dielectric material.
Options
A. True
B. False

Correct Answer

False

Explanation

Hysteresis phenomenon exists in dielectic materials.

Materials and Components problems

Search Results

2. Assertion (A): Silicon is less sensitive to changes in temperature than germanium.
Reason (R): Cut in voltage in silicon is less than that in germanium.
Options
A. Both A and R are true and R is correct explanation of A
B. Both A and R are true but R is not correct explanation of A
C. A is true but R is false
D. A is false but R is true

4. If ?_r' and ?_r" are the real and imaginary parts of complex dielectric constant ?_r, and ? is the loss angle. Then
Options
A.
B.
C. tan ? = ?'?"
D. tan ? = 1 - ?'

5. The law J = ?E, where J is current density, ? is electrical conductivity and E is field strength is
Options
A. Ohm's law
B. Gauss law
C. Ampere's law
D. Biot-Savart law

6. The hysteresis phenomenon in ferromagnetic materials exists at all temperatures.
Options
A. True
B. False

7. In paramagnetic materials
Options
A. permanent magnetic dipoles exist but the interaction between neighbouring dipoles is negligible
B. permanent magnetic dipole do not exist
C. permanent magnetic dipoles exist and the interaction between neighbouring dipoles is very strong
D. permanent magnetic dipole moment may or may not exist

8. The apparent capacitance at a high angular frequency ? of an air cored capacitor having capacitance C and inductance L is given by
Options
A.
B.
C.
D.

9. Ferroelectric materials are those which
Options
A. cannot be polarized
B. have a permanent polarization
C. have a_e equal to zero
D. have ?_p = 0

10. At room temperature, the current in intrinsic semiconductor is due to
Options
A. holes
B. electrons
C. ions
D. holes and electrons

Comments

There are no comments.

More in Electronics and Communication Engineering: